1. SMT chip Processing link: solder tempel aduk → solder tempel printing → SPI → soyo tambah → reflow soldering → AOI → rework.
2. Link pangolahan plug-in DIP: plug-in → solder gelombang → nglereni sikil → pangolahan pasca-welding → ngumbah papan → inspeksi kualitas.
3. Tes PCBA: Tes PCBA bisa dipérang dadi tes ICT, tes FCT, tes tuwa, tes geter, lsp.
4. Déwan produk Rampung: Nglumpukake cangkang saka Papan PCBA dites, banjur nyoba, lan pungkasanipun bisa dikirim.
Wektu kirim: Mei-23-2022